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74LVC2G241
Dual buffer/line driver; 3-state
Rev. 09 -- 10 June 2008 Product data sheet
1. General description
The 74LVC2G241 is a dual non-inverting buffer/line driver with 3-state outputs. The 3-state outputs are controlled by the output enable inputs 1OE and 2OE:
* A HIGH level at pin 1OE causes output 1Y to assume a high-impedance OFF-state. * A LOW level at pin 2OE causes output 2Y to assume a high-impedance OFF-state.
Schmitt trigger action at all inputs makes the circuit highly tolerant of slower input rise and fall times. Inputs can be driven from either 3.3 V or 5 V devices. This feature allows the use of the 74LVC2G241 as a translator in a mixed 3.3 V and 5 V environment. This device is fully specified for partial power-down applications using IOFF. The IOFF circuitry disables the output, preventing a damaging backflow current through the device when it is powered down.
2. Features
I I I I Wide supply voltage range from 1.65 V to 5.5 V 5 V tolerant input/output for interfacing with 5 V logic High noise immunity Complies with JEDEC standard: N JESD8-7 (1.65 V to 1.95 V) N JESD8-5 (2.3 V to 2.7 V) N JESD8-B/JESD36 (2.7 V to 3.6 V) ESD protection: N HBM JESD22-A114E exceeds 2000 V N MM JESD22-A115-A exceeds 200 V 24 mA output drive (VCC = 3.0 V) CMOS low power consumption Latch-up performance exceeds 250 mA Direct interface with TTL levels Inputs accept voltages up to 5 V Multiple package options Specified from -40 C to +85 C and -40 C to +125 C
I
I I I I I I I
NXP Semiconductors
74LVC2G241
Dual buffer/line driver; 3-state
3. Ordering information
Table 1. Ordering information Package Temperature range Name 74LVC2G241DP 74LVC2G241DC 74LVC2G241GT 74LVC2G241GD 74LVC2G241GM -40 C to +125 C -40 C to +125 C -40 C to +125 C -40 C to +125 C -40 C to +125 C TSSOP8 VSSOP8 XSON8 XSON8U XQFN8U Description plastic thin shrink small outline package; 8 leads; body width 3 mm; lead length 0.5 mm Version SOT505-2 Type number
plastic very thin shrink small outline package; 8 leads; SOT765-1 body width 2.3 mm plastic extremely thin small outline package; no leads; SOT833-1 8 terminals; body 1 x 1.95 x 0.5 mm plastic extremely thin small outline package; no leads; SOT996-2 8 terminals; UTLP based; body 3 x 2 x 0.5 mm plastic extremely thin quad flat package; no leads; 8 terminals; UTLP based; body 1.6 x 1.6 x 0.5 mm SOT902-1
4. Marking
Table 2. Marking codes Marking code V241 V41 V41 V41 V41 Type number 74LVC2G241DP 74LVC2G241DC 74LVC2G241GT 74LVC2G241GD 74LVC2G241GM
5. Functional diagram
1OE 1A 2OE 2A 2Y EN2
001aah844 001aah845
1Y EN1
1
2
Fig 1.
Logic symbol
Fig 2.
IEC logic symbol
74LVC2G241_9
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 09 -- 10 June 2008
2 of 18
NXP Semiconductors
74LVC2G241
Dual buffer/line driver; 3-state
6. Pinning information
6.1 Pinning
74LVC2G241
1OE 1 8 VCC
1A
2
7
2OE
74LVC2G241
1OE 1A 2Y GND 1 2 3 4
001aab569
8 7 6 5
VCC 2OE 1Y 2A
2Y
3
6
1Y
GND
4
5
2A
001aab570
Transparent top view
Fig 3.
Pin configuration SOT505-2 (TSSOP8) and SOT765-1 (VSSOP8)
Fig 4.
Pin configuration SOT833-1 (XSON8)
74LVC2G241
terminal 1 index area 2OE 1 VCC 8
74LVC2G241
1OE 1A 2Y GND 1 2 3 4 8 7 6 5 VCC
7
1OE
1Y 2OE 1Y 2A 2A
2
6
1A
3 4
5
2Y
GND
001aaf057
001aai247
Transparent top view
Transparent top view
Fig 5.
Pin configuration SOT996-2 (XSON8U)
Fig 6.
Pin configuration SOT902-1 (XQFN8U)
6.2 Pin description
Table 3. Symbol Pin description Pin SOT505-2, SOT765-1, SOT833-1 and SOT996-2 1OE 1A, 2A GND 1 2, 5 4 SOT902-1 7 6, 3 4 output enable input (active LOW) data input ground (0 V) Description
74LVC2G241_9
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 09 -- 10 June 2008
3 of 18
NXP Semiconductors
74LVC2G241
Dual buffer/line driver; 3-state
Table 3. Symbol
Pin description ...continued Pin SOT505-2, SOT765-1, SOT833-1 and SOT996-2 SOT902-1 2, 5 1 8 data output output enable input (active HIGH) supply voltage Description
1Y, 2Y 2OE VCC
6, 3 7 8
7. Functional description
Table 4. Input 1OE L L H
[1]
Function table[1] Output 1A L H X 2OE H H L 2A L H X 1Y L H Z 2Y L H Z
H = HIGH voltage level; L = LOW voltage level; X = don't care; Z = high-impedance OFF-state.
8. Limiting values
Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol VCC IIK VI IOK VO Parameter supply voltage input clamping current input voltage output clamping current output voltage VO > VCC or VO < 0 V enable mode disable mode Power-down mode IO ICC IGND Tstg Ptot
[1] [2] [3]
[1] [1] [1][2]
Conditions VI < 0 V
[1]
Min -0.5 -50 -0.5 -0.5 -0.5 -0.5 -100 -65
Max +6.5 +6.5 50 VCC + 0.5 +6.5 +6.5 50 100 +150 300
Unit V mA V mA V V V mA mA mA C mW
output current supply current ground current storage temperature total power dissipation
VO = 0 V to VCC
Tamb = -40 C to +125 C
[3]
-
The input and output voltage ratings may be exceeded if the input and output current ratings are observed. When VCC = 0 V (Power-down mode), the output voltage can be 5.5 V in normal operation. For TSSOP8 packages: above 55 C the value of Ptot derates linearly at 2.5 mW/K. For VSSOP8 packages: above 110 C the value of Ptot derates linearly at 8.0 mW/K. For XSON8, XSON8U and XQFN8U packages: above 45 C the value of Ptot derates linearly at 2.4 mW/K.
74LVC2G241_9
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 09 -- 10 June 2008
4 of 18
NXP Semiconductors
74LVC2G241
Dual buffer/line driver; 3-state
9. Recommended operating conditions
Table 6. Symbol VCC VI VO Operating conditions Parameter supply voltage input voltage output voltage VCC = 1.65 V to 5.5 V; enable mode VCC = 1.65 V to 5.5 V; disable mode VCC = 0 V; Power-down mode Tamb t/V ambient temperature input transition rise and fall rate VCC = 1.65 V to 2.7 V VCC = 2.7 V to 5.5 V Conditions Min 1.65 0 0 0 0 -40 Max 5.5 5.5 VCC 5.5 5.5 +125 20 10 Unit V V V V V C ns/V ns/V
10. Static characteristics
Table 7. Static characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter Tamb = -40 C to +85 C VIH HIGH-level input voltage VCC = 1.65 V to 1.95 V VCC = 2.3 V to 2.7 V VCC = 2.7 V to 3.6 V VCC = 4.5 V to 5.5 V VIL LOW-level input voltage VCC = 1.65 V to 1.95 V VCC = 2.3 V to 2.7 V VCC = 2.7 V to 3.6 V VCC = 4.5 V to 5.5 V VOL LOW-level output voltage VI = VIH or VIL IO = 100 A; VCC = 1.65 V to 5.5 V IO = 4 mA; VCC = 1.65 V IO = 8 mA; VCC = 2.3 V IO = 12 mA; VCC = 2.7 V IO = 24 mA; VCC = 3.0 V IO = 32 mA; VCC = 4.5 V VOH HIGH-level output voltage VI = VIH or VIL IO = -100 A; VCC = 1.65 V to 5.5 V IO = -4 mA; VCC = 1.65 V IO = -8 mA; VCC = 2.3 V IO = -12 mA; VCC = 2.7 V IO = -24 mA; VCC = 3.0 V IO = -32 mA; VCC = 4.5 V II input leakage current VI = 5.5 V or GND; VCC = 0 V to 5.5 V VCC - 0.1 1.2 1.9 2.2 2.3 3.8 0.1 5 V V V V V V A 0.1 0.45 0.3 0.4 0.55 0.55 V V V V V V 0.65 x VCC 1.7 2.0 0.7 x VCC 0.7 0.8 0.3 x VCC V V V V V V V Conditions Min Typ[1] Max Unit
0.35 x VCC V
74LVC2G241_9
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 09 -- 10 June 2008
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NXP Semiconductors
74LVC2G241
Dual buffer/line driver; 3-state
Table 7. Static characteristics ...continued At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter IOZ IOFF ICC ICC CI VIH OFF-state output current power-off leakage current supply current additional supply current input capacitance HIGH-level input voltage VCC = 1.65 V to 1.95 V VCC = 2.3 V to 2.7 V VCC = 2.7 V to 3.6 V VCC = 4.5 V to 5.5 V VIL LOW-level input voltage VCC = 1.65 V to 1.95 V VCC = 2.3 V to 2.7 V VCC = 2.7 V to 3.6 V VCC = 4.5 V to 5.5 V VOL LOW-level output voltage VI = VIH or VIL IO = 100 A; VCC = 1.65 V to 5.5 V IO = 4 mA; VCC = 1.65 V IO = 8 mA; VCC = 2.3 V IO = 12 mA; VCC = 2.7 V IO = 24 mA; VCC = 3.0 V IO = 32 mA; VCC = 4.5 V VOH HIGH-level output voltage VI = VIH or VIL IO = -100 A; VCC = 1.65 V to 5.5 V IO = -4 mA; VCC = 1.65 V IO = -8 mA; VCC = 2.3 V IO = -12 mA; VCC = 2.7 V IO = -24 mA; VCC = 3.0 V IO = -32 mA; VCC = 4.5 V II IOZ IOFF ICC ICC input leakage current OFF-state output current power-off leakage current supply current additional supply current VI = 5.5 V or GND; VCC = 0 V to 5.5 V VI = VIH or VIL; VO = 5.5 V or GND; VCC = 3.6 V VI or VO = 5.5 V; VCC = 0 V VI = 5.5 V or GND; IO = 0 A; VCC = 1.65 V to 5.5 V per pin; VI = VCC - 0.6 V; IO = 0 A; VCC = 2.3 V to 5.5 V VCC - 0.1 0.95 1.7 1.9 2.0 3.4 20 20 20 40 5 V V V V V V A A A A mA 0.1 0.70 0.45 0.60 0.80 0.80 V V V V V V Conditions VI = VIH or VIL; VO = 5.5 V or GND; VCC = 3.6 V VI or VO = 5.5 V; VCC = 0 V VI = 5.5 V or GND; IO = 0 A; VCC = 1.65 V to 5.5 V per pin; VI = VCC - 0.6 V; IO = 0 A; VCC = 2.3 V to 5.5 V Min 0.65 x VCC 1.7 2.0 0.7 x VCC Typ[1] Max 0.1 0.1 0.1 5 2 10 10 10 500 0.7 0.8 0.3 x VCC Unit A A A A pF V V V V V V V
Tamb = -40 C to +125 C
0.35 x VCC V
[1]
Typical values are measured at VCC = 3.3 V and Tamb = 25 C.
74LVC2G241_9
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 09 -- 10 June 2008
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NXP Semiconductors
74LVC2G241
Dual buffer/line driver; 3-state
11. Dynamic characteristics
Table 8. Dynamic characteristics Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 10. Symbol Parameter tpd Conditions Min propagation delay nA to nY; see Figure 7 VCC = 1.65 V to 1.95 V VCC = 2.3 V to 2.7 V VCC = 2.7 V VCC = 3.0 V to 3.6 V VCC = 4.5 V to 5.5 V ten enable time 1OE to 1Y; see Figure 8 VCC = 1.65 V to 1.95 V VCC = 2.3 V to 2.7 V VCC = 2.7 V VCC = 3.0 V to 3.6 V VCC = 4.5 V to 5.5 V 2OE to 2Y; see Figure 9 VCC = 1.65 V to 1.95 V VCC = 2.3 V to 2.7 V VCC = 2.7 V VCC = 3.0 V to 3.6 V VCC = 4.5 V to 5.5 V tdis disable time 1OE to 1Y; see Figure 8 VCC = 1.65 V to 1.95 V VCC = 2.3 V to 2.7 V VCC = 2.7 V VCC = 3.0 V to 3.6 V VCC = 4.5 V to 5.5 V 2OE to 2Y; see Figure 9 VCC = 1.65 V to 1.95 V VCC = 2.3 V to 2.7 V VCC = 2.7 V VCC = 3.0 V to 3.6 V VCC = 4.5 V to 5.5 V
[4] [4] [3] [3] [2]
-40 C to +85 C Typ[1] 4.5 2.8 2.8 2.6 2.1 5.2 3.1 3.2 2.7 2.0 4.3 2.7 2.7 2.5 1.9 3.2 2.2 2.8 2.6 2.0 3.6 2.0 3.2 2.8 2.0 Max 8.8 4.9 4.7 4.3 3.7 9.9 5.6 5.5 4.7 3.8 8.8 4.7 4.6 4.1 3.3 11.6 5.8 4.6 4.4 3.4 12.5 5.2 4.9 4.2 3.3
-40 C to +125 C Unit Min 1.0 0.5 1.0 0.5 0.5 1.5 1.0 1.5 0.5 0.5 1.0 1.0 1.0 1.0 0.5 1.0 0.5 1.0 1.0 0.5 1.0 0.5 1.5 1.0 0.5 Max 11.0 6.3 5.9 5.4 4.6 12.4 7.0 6.9 5.9 4.8 11.0 5.9 5.8 5.1 4.1 14.1 7.6 5.9 5.7 4.6 15.2 6.9 6.3 5.4 4.4 ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns
1.0 0.5 1.0 0.5 0.5 1.5 1.0 1.5 0.5 0.5 1.0 1.0 1.0 1.0 0.5 1.0 0.5 1.0 1.0 0.5 1.0 0.5 1.5 1.0 0.5
74LVC2G241_9
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 09 -- 10 June 2008
7 of 18
NXP Semiconductors
74LVC2G241
Dual buffer/line driver; 3-state
Table 8. Dynamic characteristics ...continued Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 10. Symbol Parameter CPD power dissipation capacitance Conditions Min per buffer; VI = GND to VCC output enabled output disabled
[1] [2] [3] [4] [5] Typical values are measured at nominal VCC and at Tamb = 25 C. tpd is the same as tPLH and tPHL. ten is the same as tPZH and tPZL. tdis is the same as tPLZ and tPHZ. CPD is used to determine the dynamic power dissipation (PD in W). PD = CPD x VCC2 x fi x N + (CL x VCC2 x fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in V; N = number of inputs switching; (CL x VCC2 x fo) = sum of outputs.
[5]
-40 C to +85 C Typ[1] 20 5 Max -
-40 C to +125 C Unit Min Max pF pF
-
12. Waveforms
VI nA input GND
VM
tPHL VOH
nY output VOL
tPLH
VM
mna230
Measurement points are given in Table 9. Logic levels: VOL and VOH are typical output voltage levels that occur with the output load.
Fig 7. Table 9. VCC
The data input (nA) to output (nY) propagation delays Measurement points Input VM 0.5 x VCC 0.5 x VCC 1.5 V 1.5 V 0.5 x VCC Output VM 0.5 x VCC 0.5 x VCC 1.5 V 1.5 V 0.5 x VCC VX VOL + 0.15 V VOL + 0.15 V VOL + 0.3 V VOL + 0.3 V VOL + 0.3 V VY VOH - 0.15 V VOH - 0.15 V VOH - 0.3 V VOH - 0.3 V VOH - 0.3 V
Supply voltage 1.65 V to 1.95 V 2.3 V to 2.7 V 2.7 V 3.0 V to 3.6 V 4.5 V to 5.5 V
74LVC2G241_9
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 09 -- 10 June 2008
8 of 18
NXP Semiconductors
74LVC2G241
Dual buffer/line driver; 3-state
VI 1OE input GND t PLZ VCC output LOW-to-OFF OFF-to-LOW VOL t PHZ VOH output HIGH-to-OFF OFF-to-HIGH GND outputs enabled outputs disabled outputs enabled
mna730
VM
t PZL
VM VX t PZH VY VM
Measurement points are given in Table 9. Logic levels: VOL and VOH are typical output voltage levels that occur with the output load.
Fig 8.
Enable and disable times for input 1OE
VI 2OE input GND t PLZ VCC output LOW-to-OFF OFF-to-LOW VOL t PHZ VOH output HIGH-to-OFF OFF-to-HIGH GND outputs enabled outputs disabled outputs enabled
mna731
VM
t PZL
VM VX t PZH VY VM
Measurement points are given in Table 9. Logic levels: VOL and VOH are typical output voltage levels that occur with the output load.
Fig 9.
Enable and disable times for input 2OE
74LVC2G241_9
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 09 -- 10 June 2008
9 of 18
NXP Semiconductors
74LVC2G241
Dual buffer/line driver; 3-state
VEXT VCC VI VO DUT
RT CL RL RL
G
mna616
Test data is given in Table 10. Definitions for test circuit: RL = Load resistance. CL = Load capacitance including jig and probe capacitance. RT = Termination resistance should be equal to the output impedance Zo of the pulse generator. VEXT = External voltage for measuring switching times.
Fig 10. Load circuit for measuring switching times Table 10. Test data Input VI 1.65 V to 1.95 V 2.3 V to 2.7 V 2.7 V 3.0 V to 3.6 V 4.5 V to 5.5 V VCC VCC 2.7 V 2.7 V VCC Load CL 30 pF 30 pF 50 pF 50 pF 50 pF RL 1 k 500 500 500 500 VEXT tPLH, tPHL open open open open open tPZH, tPHZ GND GND GND GND GND tPZL, tPLZ 2 x VCC 2 x VCC 6V 6V 2 x VCC
Supply voltage
74LVC2G241_9
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 09 -- 10 June 2008
10 of 18
NXP Semiconductors
74LVC2G241
Dual buffer/line driver; 3-state
13. Package outline
TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm; lead length 0.5 mm SOT505-2
D
E
A
X
c y HE vMA
Z
8
5
A pin 1 index
A2 A1
(A3)
Lp L
1
e bp
4
wM
detail X
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.1 A1 0.15 0.00 A2 0.95 0.75 A3 0.25 bp 0.38 0.22 c 0.18 0.08 D(1) 3.1 2.9 E(1) 3.1 2.9 e 0.65 HE 4.1 3.9 L 0.5 Lp 0.47 0.33 v 0.2 w 0.13 y 0.1 Z(1) 0.70 0.35 8 0
Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT505-2 REFERENCES IEC JEDEC --JEITA EUROPEAN PROJECTION ISSUE DATE 02-01-16
Fig 11. Package outline SOT505-2 (TSSOP8)
74LVC2G241_9 (c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 09 -- 10 June 2008
11 of 18
NXP Semiconductors
74LVC2G241
Dual buffer/line driver; 3-state
VSSOP8: plastic very thin shrink small outline package; 8 leads; body width 2.3 mm
SOT765-1
D
E
A X
c y HE vMA
Z
8
5
Q A pin 1 index A2 A1 (A3) Lp L
1
e bp
4
wM
detail X
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1 A1 0.15 0.00 A2 0.85 0.60 A3 0.12 bp 0.27 0.17 c 0.23 0.08 D(1) 2.1 1.9 E(2) 2.4 2.2 e 0.5 HE 3.2 3.0 L 0.4 Lp 0.40 0.15 Q 0.21 0.19 v 0.2 w 0.13 y 0.1 Z(1) 0.4 0.1 8 0
Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT765-1 REFERENCES IEC JEDEC MO-187 JEITA EUROPEAN PROJECTION
ISSUE DATE 02-06-07
Fig 12. Package outline SOT765-1 (VSSOP8)
74LVC2G241_9 (c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 09 -- 10 June 2008
12 of 18
NXP Semiconductors
74LVC2G241
Dual buffer/line driver; 3-state
XSON8: plastic extremely thin small outline package; no leads; 8 terminals; body 1 x 1.95 x 0.5 mm
SOT833-1
1
2
3
b 4 4x L
(2)
L1
e
8 e1
7 e1
6 e1
5
8x
(2)
A
A1 D
E
terminal 1 index area 0 DIMENSIONS (mm are the original dimensions) UNIT mm A(1) max 0.5 A1 max 0.04 b 0.25 0.17 D 2.0 1.9 E 1.05 0.95 e 0.6 e1 0.5 L 0.35 0.27 L1 0.40 0.32 1 scale 2 mm
Notes 1. Including plating thickness. 2. Can be visible in some manufacturing processes. OUTLINE VERSION SOT833-1 REFERENCES IEC --JEDEC MO-252 JEITA --EUROPEAN PROJECTION ISSUE DATE 07-11-14 07-12-07
Fig 13. Package outline SOT833-1 (XSON8)
74LVC2G241_9 (c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 09 -- 10 June 2008
13 of 18
NXP Semiconductors
74LVC2G241
Dual buffer/line driver; 3-state
XSON8U: plastic extremely thin small outline package; no leads; 8 terminals; UTLP based; body 3 x 2 x 0.5 mm
SOT996-2
D
B
A
E
A
A1
detail X terminal 1 index area e1 L1
1
e
b
4
v w
M M
CAB C
C y1 C y
L2
L
8 5
X
0
1 scale
2 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max 0.5 A1 0.05 0.00 b 0.35 0.15 D 2.1 1.9 E 3.1 2.9 e 0.5 e1 1.5 L 0.5 0.3 L1 0.15 0.05 L2 0.6 0.4 v 0.1 w 0.05 y 0.05 y1 0.1
OUTLINE VERSION SOT996-2
REFERENCES IEC --JEDEC JEITA ---
EUROPEAN PROJECTION
ISSUE DATE 07-12-18 07-12-21
Fig 14. Package outline SOT996-2 (XSON8U)
74LVC2G241_9 (c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 09 -- 10 June 2008
14 of 18
NXP Semiconductors
74LVC2G241
Dual buffer/line driver; 3-state
XQFN8U: plastic extremely thin quad flat package; no leads; 8 terminals; UTLP based; body 1.6 x 1.6 x 0.5 mm
SOT902-1
D terminal 1 index area
B
A
E
A A1
detail X
L1 L
e
4
e v M C A B w M C
5
C y1 C y
3
metal area not for soldering
2 6
b
e1
e1
7 1
terminal 1 index area
8
X
0
1 scale
2 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max 0.5 A1 0.05 0.00 b 0.25 0.15 D 1.65 1.55 E 1.65 1.55 e 0.55 e1 0.5 L 0.35 0.25 L1 0.15 0.05 v 0.1 w 0.05 y 0.05 y1 0.05
OUTLINE VERSION SOT902-1
REFERENCES IEC --JEDEC MO-255 JEITA ---
EUROPEAN PROJECTION
ISSUE DATE 05-11-25 07-11-14
Fig 15. Package outline SOT902-1 (XQFN8U)
74LVC2G241_9 (c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 09 -- 10 June 2008
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NXP Semiconductors
74LVC2G241
Dual buffer/line driver; 3-state
14. Abbreviations
Table 11. Acronym CMOS DUT ESD HBM MM TTL Abbreviations Description Complementary Metal-Oxide Semiconductor Device Under Test ElectroStatic Discharge Human Body Model Machine Model Transistor-Transistor Logic
15. Revision history
Table 12. Revision history Release date 20080610 Data sheet status Product data sheet Product data sheet Product data sheet Product data sheet Product specification Product specification Product specification Product specification Product specification Change notice Supersedes 74LVC2G241_8 74LVC2G241_7 74LVC2G241_6 74LVC2G241_5 74LVC2G241_4 74LVC2G241_3 74LVC2G241_2 74LVC2G241_1 Document ID 74LVC2G241_9 Modifications: 74LVC2G241_8 74LVC2G241_7 74LVC2G241_6 74LVC2G241_5 74LVC2G241_4 74LVC2G241_3 74LVC2G241_2 74LVC2G241_1
*
Added type number 74LVC2G241GD (XSON8U package)
20080312 20071005 20060922 20050202 20040922 20030311 20030129 20021030
74LVC2G241_9
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 09 -- 10 June 2008
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NXP Semiconductors
74LVC2G241
Dual buffer/line driver; 3-state
16. Legal information
16.1 Data sheet status
Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet
[1] [2] [3]
Product status[3] Development Qualification Production
Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification.
Please consult the most recently issued document before initiating or completing a design. The term `short data sheet' is explained in section "Definitions". The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
16.2 Definitions
Draft -- The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet -- A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.
malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications -- Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values -- Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale -- NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license -- Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
16.3 Disclaimers
General -- Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes -- NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use -- NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or
16.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners.
17. Contact information
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com
74LVC2G241_9
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 09 -- 10 June 2008
17 of 18
NXP Semiconductors
74LVC2G241
Dual buffer/line driver; 3-state
18. Contents
1 2 3 4 5 6 6.1 6.2 7 8 9 10 11 12 13 14 15 16 16.1 16.2 16.3 16.4 17 18 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 Functional description . . . . . . . . . . . . . . . . . . . 4 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 Recommended operating conditions. . . . . . . . 5 Static characteristics. . . . . . . . . . . . . . . . . . . . . 5 Dynamic characteristics . . . . . . . . . . . . . . . . . . 7 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 11 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 16 Legal information. . . . . . . . . . . . . . . . . . . . . . . 17 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 17 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Contact information. . . . . . . . . . . . . . . . . . . . . 17 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Please be aware that important notices concerning this document and the product(s) described herein, have been included in section `Legal information'.
(c) NXP B.V. 2008.
All rights reserved.
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 10 June 2008 Document identifier: 74LVC2G241_9

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